Modified Polyimide Binder Dispersion
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Modified Polyimide Binder Dispersion

Modified Polyimide Binder Dispersion

Cat No:BMBSA-0063

Description

An aqueous-based polyimide dispersion specifically designed for cathode coatings requiring high thermal stability and chemical resistance.

Basic Information

Physical Form Brownish Liquid
Purity (%) N/A
Moisture Content (ppm) 80% Water
Density (g/cm³) 1.12
Boiling Point (°C) 100
Solubility in Electrolyte Water Miscible
Electrochemical Window (V) N/A
Acid Content (ppm) N/A
Flash Point (°C) >100
Viscosity (mPa·s) 500-2000
Particle Size (D50) N/A
Surface Area (m²/g) N/A
pH Value 7.0-9.0
Solid Content (%) 18-22
Metal Impurities (ppm) ≤15
Chloride Content (ppm) ≤30
Sulfate Content (ppm) ≤30
Recommended Dosage (wt%) 2.0-5.0
Main Function Cathode Bonding
Application Phase Slurry Preparation
Storage Temperature (°C) 5-15
Shelf Life (Months) 6

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