Modified Polyimide (PI) Binder
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Modified Polyimide (PI) Binder

Modified Polyimide (PI) Binder

Cat No:BMBB-0015

Description

A high-tensile strength aromatic polymer binder for high-voltage systems requiring extreme oxidative resistance and thermal robustness.

Basic Information

Appearance Dark Amber Liquid
Solid Content (%) 12-18
Viscosity (mPa·s) 3000 - 7000
pH Value 4.0 - 6.0
Density (g/cm³) 1.15 - 1.25
Purity (%) ≥ 98.5
Moisture Content (%) 85 (NMP)
Melting Point (°C) N/A
Decomposition Temp (°C) > 500
Molecular Weight (Mw) 150,000 - 300,000
Particle Size D50 (μm) N/A
Tensile Strength (MPa) 120 - 180
Elongation at Break (%) 10-30
Peel Strength (N/m) ≥ 35
Glass Transition Temp (°C) 280
Solvent Type NMP
Application Type High Voltage Cathode
Active Material Compatibility LMNO, NCM 811
Coating Thickness (μm) 5 - 40
Drying Condition 250°C / 2h
Swelling Ratio (%) < 2
Ion Conductivity Low
Electrochemical Window (V) 0.0 - 5.2
Storage Life (Months) 12

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