| Material Composition | Copper / Nickel Plate |
| Thickness (μm) | 10000 |
| Density (g/cm³) | 8.9 |
| Surface Resistance (mΩ·cm²) | < 0.1 |
| Tensile Strength (MPa) | 250 |
| Thermal Conductivity (W/m·K) | 380 |
| Operating Temp Max (°C) | 250 |
| Flexural Strength (MPa) | N/A |
| Corrosion Resistance (μA/cm²) | < 0.2 |
| Contact Angle (°) | 80 |
| Coefficient of Thermal Expansion (10⁻⁶/K) | 16.8 |
| Shore Hardness | 90 (HB) |
| Mean Pore Size (μm) | N/A |
| Compressive Strength (MPa) | 280 |
| Electrical Conductivity (S/cm) | 5.5x10⁵ |
| Specific Surface Area (m²/g) | N/A |
| Young's Modulus (GPa) | 110 |
| Chemical Stability | Good |
| Coating Material | 10μm Nickel |
| Surface Roughness (Ra) | 0.4 |
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