Rigid Polyamide-Imide (PAI) Binder
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Rigid Polyamide-Imide (PAI) Binder

Rigid Polyamide-Imide (PAI) Binder

Cat No:BMBB-0056

Description

A high-strength aromatic binder system with exceptional thermal stability for ultra-thick electrodes and high-power discharge.

Basic Information

Appearance Amber Solution
Solid Content (%) 15 - 18
Viscosity (mPa·s) 4000 - 8000
pH Value 4.0 - 6.0
Density (g/cm³) 1.20 - 1.25
Purity (%) ≥ 99.0
Moisture Content (%) 84 (NMP)
Melting Point (°C) N/A
Decomposition Temp (°C) > 450
Molecular Weight (Mw) 150,000 - 250,000
Particle Size D50 (μm) N/A
Tensile Strength (MPa) 130 - 180
Elongation at Break (%) 10-25
Peel Strength (N/m) ≥ 35
Glass Transition Temp (°C) 260
Solvent Type NMP
Application Type Thick Cathode
Active Material Compatibility NCM 811, LMNO
Coating Thickness (μm) 100 - 300
Drying Condition 180°C / 4h
Swelling Ratio (%) < 3
Ion Conductivity Low
Electrochemical Window (V) 0.0 - 5.1
Storage Life (Months) 12

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