Tantalum-Clad Copper Foil

Cat No:BMBCC-0064

Description

Composite foil featuring a tantalum surface for acid resistance and a copper core for maximum electronic conductivity.

Datasheet

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Basic Information

Substrate Material	Ta-Cu-Ta
Purity (%)	Ta: 5μm (each)
Thickness (μm)	20 (Total)
Width (mm)	100
Areal Density (g/m²)	190 - 210
Tensile Strength (MPa)	≥320
Elongation (%)	≥5.0
Surface Finish	Roll Clad
Surface Roughness (Ra, μm)	≤0.30
Electrical Resistivity (Ω·m)	1.9 x 10⁻⁸
Thermal Conductivity (W/m·K)	350
Melting Point (°C)	1083 (Cu)
Oxidation Resistance (Temp/Time)	400°C / 30min
Coating Type	Tantalum Cladding
Coating Thickness (μm)	5
Core ID (mm)	76
Standard Length (m)	2
Operating Voltage Range (V)	0.0 - 6.0
Application Compatibility	Extreme Acid Cells
Storage Requirements	Dry / Sealed
Form Factor	Roll
Hydrophilic Properties	Ultra-Inert
Compliance / Grade	Industrial Grade

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