Thermosetting Polyimide Adhesive
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Thermosetting Polyimide Adhesive

Thermosetting Polyimide Adhesive

Cat No:BMBB-0046

Description

A rigid PI binder system designed for extreme temperature environments, remaining mechanically stable up to 300°C without deformation.

Basic Information

Appearance Amber Solution
Solid Content (%) 15 - 20
Viscosity (mPa·s) 4000 - 9000
pH Value 3.0 - 5.0
Density (g/cm³) 1.20 - 1.28
Purity (%) ≥ 99.0
Moisture Content (%) 82 (NMP)
Melting Point (°C) N/A
Decomposition Temp (°C) > 520
Molecular Weight (Mw) 150,000 - 280,000
Particle Size D50 (μm) N/A
Tensile Strength (MPa) 150 - 220
Elongation at Break (%) 5-15
Peel Strength (N/m) ≥ 38
Glass Transition Temp (°C) 310
Solvent Type NMP
Application Type Extreme Temp Cell
Active Material Compatibility LTO, LNMO
Coating Thickness (μm) 5 - 40
Drying Condition 250°C / 3h
Swelling Ratio (%) < 2
Ion Conductivity Low
Electrochemical Window (V) 0.0 - 5.4
Storage Life (Months) 12

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