High-Temperature Resistant Epoxy Resin Adhesive, 860 cPs product detail at Eata Ray
High-Temperature Resistant Epoxy Resin Adhesive, 860 cPs
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High-Temperature Resistant Epoxy Resin Adhesive, 860 cPs

High-Temperature Resistant Epoxy Resin Adhesive, 860 cPs

Cat No:AMOA-0044

Basic Information

Main Components Epoxy resin
Viscosity 860 cPs
Curing Conditions 80°C: 60min, 100: 30min, 150: 30min
Glass Transition Temperature (Tg) 102°C
Coefficient of Thermal Expansion (CTE) 65 ppm/°C
Hardness 82
Operating Temperature -55°C~200°C
Storage Conditions Store away from light at room temperature (25°C). Do not refrigerate. After use, close the lid promptly to prevent moisture exposure.

Features

Features High glass transition temperature after curing, with good solvent resistance

Applications

Applications It is used for substrate bonding, filling, potting, and coating in various industries including fiber optic communications, optoelectronics, semiconductors, hybrid circuits, and medical applications.

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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