| Main Components | Epoxy resin |
| Viscosity | 25000 cPs |
| Curing Conditions | 100 mW/cm2: 10min |
| Glass Transition Temperature (Tg) | 206°C |
| Adhesion | >116 kgf/cm2 |
| Cure Shrinkage | 2% |
| Coefficient of Thermal Expansion (CTE) | 23 ppm/°C |
| Operating Temperature | -65°C~300°C |
| Storage Conditions | Store away from light at room temperature (25°C). Do not refrigerate. After use, close the lid promptly to prevent moisture exposure. |
| Features | Capable of bonding sub-micron-level components with low curing shrinkage and low thermal expansion coefficient |
| Applications | It is used in data center optical interconnects, AR/VR optical modules, hydrogen energy equipment, wearable medical devices, and autonomous driving sensors to provide nanoscale substrate bonding, full-spectrum light-transmitting coupling, lightweight structural filling, and flexible device coating protection. |
Eata Ray is your trusted partner for high-precision optoelectronic components, integrated processing services and comprehensive testing solutions—driving your innovation forward, every step of the way.
For Research or Industrial Raw Materials, Not For Personal Medical Use!
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Eata Ray is your trusted partner for high-precision optoelectronic components, integrated processing services and comprehensive testing solutions—driving your innovation forward, every step of the way.
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